ZM-R6200 Rework Game board machine, Rework computer laptop BGA station Solder BGA Station with 10 years experience
|Type:Reflow Solder||Place of Origin:Guangdong China (Mainland)||Brand Name:ZHUOMAO(ZM)||Model Number:ZM-R6200 Rework Game board Machine|
|Usage:Rework Game board machine||Voltage:220V||Weight:65kg||Dimensions:L640*W630*H900mm|
|Rated Duty Cycle:100%||Rated Capacity:N/A||Current:22A||Certification:CE,ISO&CE|
|After-sales Service Provided:Engineers available to service machinery overseas||function:Rework Game board machine||Feature:semi automatical and optical alignment vision system||Warranty:1 Year|
|Company Type:manufacturer||Electrical materials:temperature control system Adopted Dalian University of Technology||Repair bga chip size:1*1-80*80mm|
Item: ZM-R6200 Remove and replace BGA Chip for laptop,xbox360, mobile andDME
Usage:Desolder and solder all the BGA Chip.Rework BGA Machine, Desolder BGA Machine, Solder BGA machine, remove and repair computer, xbox360 and mobile motherboard BGA Chip. such as GPU, CPU, Graphic card, south bridge, north bridge etc. even for lead free BGA Chip.
1, semi automatical desolder, solder,weld BGA Chip of laptop, computer, xbox360 and motherboard. even for lead free BGA Chip.
2, Top and bottom hot air heaters and 3rd infrared heater.
3,top heater is stepped drive control.
4,Touch screen and joystick control, easy operation.
5, Stable and precise temperature, ensure good welding effect.
6,High optical alignment vision system could clearly and precisely make BGA Chip match with motherboard.
8,Warranty: 1 year.
|1||Total power||4800W Max|
|2||Top heater power||800W (1stheater)|
|3||Bottom heater power||1200W (2ndheater)|
|4||3rd IR heater||2700W (independent controlling left and right IR heaters)|
|5||power||AC 220V±10 50/60Hz|
|6||Electrical materials||temperature control system Adopted Dalian University of Technology|
|8||Temperature control||K-type thermocouple (Closed Loop), intelligent temperature compensation system|
|9||Positioning||V type groove,with universal fixture|
|9||P C B size||Max 410×370mm, Min65×65mm|
|10||Available BGA chip||1×1~ 80×80mm|
|11||External temperature sensor||1piece|
Certification: CE and ISO9001:2008
|Packaging Detail:ZM-R6200 Rework computer laptop BGA station package details as following:1,Standard Wooden Case 2,Dimension:L76cm*W78cm*H104cm3.G.W. is 120KG|
|Delivery Detail:1-3 workdays after confirmed order|