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1.Rework Game board machine, 2.Optical alignment vision system, 3.Hot air & Infrared heater, 4.Touch screen, 5,semi automatical - details see: https://www.machineto.com/zm-r6200-rework-game-board-machine-rework-computer-laptop-bga-station-solder-bga-station-with-10-years-experience-10138002

Item: ZM-R6200 Remove and replace BGA Chip for laptop,xbox360, mobile andDME

Usage:Desolder and solder all the BGA Chip.Rework BGA Machine, Desolder BGA Machine, Solder BGA machine, remove and repair computer, xbox360 and mobile motherboard BGA Chip. such as GPU, CPU, Graphic card, south bridge, north bridge etc. even for lead free BGA Chip.

Feature:

1, semi automatical desolder, solder,weld BGA Chip of laptop, computer, xbox360 and motherboard. even for lead free BGA Chip.

2, Top and bottom hot air heaters and 3rd infrared heater.

3,top heater is stepped drive control.

4,Touch screen and joystick control, easy operation.

5, Stable and precise temperature, ensure good welding effect.

6,High optical alignment vision system could clearly and precisely make BGA Chip match with motherboard.

7, USB.

8,Warranty: 1 year.

Specification parameters:

1	Total power	4800W Max
2	Top heater power	800W (1stheater)
3	Bottom heater power	1200W (2ndheater)
4	3rd IR heater	2700W (independent controlling left and right IR heaters)
5	power	AC 220V±10 50/60Hz
6	Electrical materials	temperature control system Adopted Dalian University of Technology
7	Dimensions	L640*W630*H900mm
8	Temperature control	K-type thermocouple (Closed Loop), intelligent temperature compensation system
9	Positioning	V type groove,with universal fixture
9	P C B size	Max 410×370mm, Min65×65mm
10	Available BGA chip	1×1~ 80×80mm
11	External temperature sensor	1piece
12	Net weight	65kg
13	Package	Wooden box
14	G.W.	120KG
15	Dimension	L75cm*W75cm*H90cm

Machine Photos:

Certification: CE and ISO9001:2008

Factory photos: