Vision Solder BGA Station ZM-R5860C BGA Reballing kit Repair motherboard BGA machine

1.IC reballing kit, 2.Repair motherboard machine, 3.Hot air& Infrared heater, 4. precise heating, 5,BGA Chip repair - details see: https://www.machineto.com/vision-solder-bga-station-zm-r5860c-bga-reballing-kit-repair-motherboard-bga-machine-10138184
Type:Reflow SolderPlace of Origin:Guangdong China (Mainland)Brand Name:ZHUOMAO(ZM)Model Number:ZM-R5860C IC Reballing kit
Usage:Reballing kitVoltage:220VWeight:40KGDimensions:L635*W600*H560mm
Rated Duty Cycle:100%Rated Capacity:No batteryCurrent:22ACertification:CE,ISO&CE
After-sales Service Provided:Engineers available to service machinery overseasfunction:Vision Reballing kitWarranty:1 YearFeature:Vision solder BGA Machine
business type:manufacturerexperience:10 years.Repair:Laptop, xbox360, mobile and car CPUG.W.:80KG.
Package size:L78*W76*H77cm.Brand:ZHUOMAO(ZM)  
Vision Solder BGA Station ZM-R5860C BGA Reballing kit Repair motherboard BGA machine
contact supplier for Vision Solder BGA Station ZM-R5860C BGA Reballing kit Repair motherboard BGA machine


ZM-R5860C Reballing kit

1) Main Feature, solder, desolder, remove/mount/weld bga chip of laptop/xbox360/mobile motherboard with vision system.

1.Touch screen operation
2.Repair motherboard machine
3.Hot air& Infrared heater
4. Precise temperature
5, Repair PSP,mobileoard.

6, Got CE, ISO9001:2009 certification

7, Hotselling ZHUOMAO modle

8, Meet Lead and Lead free solder ball solder, desodler, welding repair meet.

9, stable function

2) Specifications and Technical parameters

1Total Power4850W
2Top heater800W
3Bottom heater2ndheater 1200W,3rdIR heater 2700W
4powerAC220V±10% 50/60Hz
5DimensionsL635*W600*H560 mm
6PositioningV-groove, PCB support can be adjusted in any direction and with external universal fixture
7Temperature controlK-type thermocouple (Closed Loop), heating independently, temperature precision within ±3 degree
8PCB sizeMax 410*370mm Min 20*20mm
9Electrical materialsTaiwan touch screen + Delta PLC + high precision intelligent temperature control module
10Net weight40KG

3) packing photo

4) Certification

5) ZHUOMAO Factory photos

Vision Solder BGA Station ZM-R5860C BGA Reballing kit Repair motherboard BGA machine
Packaging Detail:ZM-R5860C solder BGA station package details:1,Standard Wooden Case 2,Dimension:L78*W76*H77cm3.GW:80 KG
Delivery Detail:1-3 workdays after payment

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