SHUTTLE STAR BGA machine RW-B400C

Professional bga machine RW-B400C, *3 heaters , Siemens PLC control, touch screen, *repari laptop , xbox , ps2/3 ... - details see: https://www.machineto.com/shuttle-star-bga-machine-rw-b400c-10138066

Place of Origin:Guangdong China (Mainland)	Brand Name:shuttle star	Model Number:RW-B400C	Voltage:single-phase 220V
Dimensions:660630600mm	Weight:60kgs	Usage:bga rework	certificate:ISO 9001:2000 CE
Origin:Shenzhen ,China	color:black

SHUTTLE STAR BGA machine RW-B400C

Specification:
Applicable PCB:W50*D50~W450*D400mm
Temperature control:K-type thermocouple, close cycle controlled
Upper heater(hot air):400W
Lower heater(hot air):800W
Bottom IR heater:2700W
Machine Dimension:660*630*600mm
Machine Weight:60KG
Power supply:AC 220V 50/60Hz

Features:
1. Made of high quality heating material; desoldering and soldering procedures of
BGA are precisely controlled;
2. Movable heating head, which is able to move freely horizontally, easy to operated;
3. Embedded industrial computer, Simens PLC control, real-time profile display, able
to display set profile and practically-tested profile;
4. Big size screen, easy to operate;

5. Connect USB mouse, easy to operate
6. Profile saving up to 50000 in this industrial computer, can analyze the two
practically-tested profiles, can input both English and Chinese;
7. The temperatures of the upper and lower hot air heaters can be precisely controlled
according to their specific temperatures. The infrared constant temperature heating
zone at the bottom area and the appropriate temperature-control settings make the
rework safer and more reliable.
8. The supports for the BGA soldering supporting frame are micro-adjustable to
restrain local sinkage.
9. Powerful cross flow fans cool the lower heating area rapidly;
10. The adjustable PCB positioning support, onto which the special fixtures for
alloyed board could be installed, enables easy and fast positioning of the PCB
board;
11. Buzz after soldering is finished or desoldering; Hand vacuum pen is adjustable for
removing BGA;
12. Both the upper and lower parts are equipped with over-temperature alarming and
protection apparatus.
13.With different alloy hot gas nozzles, easy to replace. It could be tailored as per the
specific requirements.
14.The software can be updated to auto-profile in future by USB, no need to set
profiles.