Semiconductor Equipment Thermoelectric Cooling

Thermoelectric Cooling, 1Fast cool,easily-operate, 2No pollute,no noise,high efficiency, 3With unique design - details see: https://www.machineto.com/semiconductor-equipment-thermoelectric-cooling-10247202
Place of Origin:Henan China (Mainland)Brand Name:Xin-HongchangModel Number:TES1-3124Type:Heat Exchanger Tube
Application:Refrigeration Parts,Refrigerator,car,,drink cooler,laser diodes.picnic cooler.othersCertification:RoHS,ROHS,REACH,SGS,ISO9011,ISO14000Material:Wire,Se,Bi,Te,Sn,SbAdvantage:Fast cool in 3 second,12V
Appearance:Cube&WhiteMain Market:Europe,AmericasQuality:Exported standard 
Semiconductor Equipment Thermoelectric Cooling
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Semiconductor Equipment Thermoelectric Cooling

Item No.:TES1-3124
Item Size:15*15*4.2
Color Avaliable:white
Material:Ceramic Substrate.Sb.Se.Sn.Te.Bi.Non-ferrous materials Wire
Tmax:>68(T)
Vmax:3.7(V)
Qmax:5.5(w)
Lmax:2.4(A)
MOQ;50pcs

Unique selling points

1Durable semiconductor cooling module adopt Developed Countries super technology.

2With high Creditability,stable performance,and unique design.

3We welcome any requirement about product design you raise.

4We exported to American, the United Kingdom for years.

5Powerful teamwork with manufacturing single-stage and multistage thermoelectric modules at super efficiency,qualitty.

6Produce 100,000pcs per month.

Technical reference and check requiryment

1One quality check report attached to each batch

2The quality check pass report testifies that the product is of the equal reference to the sample.

Refrigeration principle

The transfer of energy. Of a typical electricity supplier and a P-type N-temperature electric Components into one pair of electricity through the conductor connected story, through direct current, in joints Service will produce strong and energy transfer, call the end decalescence story. the other side Exothermic, when currents from N-P. decalescence-called cold side, exothermic-called hot side. Change the current direction of the cold and hot-swap. Temperature components is electricity. Several of the linked call anyone, and the hot-hot-parallel connection, with the cold-cold parallel connection .connected direct current. the hot-install components in the temperature of heat release devices, Distributed as soon as possible to generate heat off, the cold-smoking on the work environment Heat .which is typical of the basic operating principles of refrigeration components.

The right way to use our product

1. Voltage current work To improve device reliability, practical work voltage, current work should be less than the maximum voltage devices, the largest current, practical applications in the 127 series of general voltage controlled 12-13V.And the most hot noodles High temperature not exceeding 90 degrees, the electricity supply Wenbo factor less than 10%

2.temperature control Cold and hot noodle temperature changes dramatically reduce device reliability and longevity, it would be desirable to Continuous control voltage or current electricity, polarity cut over(change current direction)will also enable Device reliability and lower life expectancy.

3.radiator The smoking device being heated face radiator heat dissipation of heat capacity and efficiency influence, The choice of hot noodles radiator to be large enough to ensure their ability to heat release, Then in the assembly Area must be evenly doodle with the heat conduction rate Guizhi to minimize4 Rezu .No hot noodles with heat release, not connected power.

4.pressure Securing devices, device pressure over10kg/cm*cm will be significantly reduced by pieces of reliability. Therefore the installation of devicesa to the surface as possible so that devices are affected by the power Absorbed, the pressure appropriate.

5.conductors Wire towards themselves, red line in right, black lines in the left. Red line with the positive power Linked with cathode joined black line Then in the side to cool.

We obtains many patents in the production process, spurts the nickel technology and Galvanization technology.

Shipping

Shipping usually by UPS/DHL/EMS. only if you have not any requirement.

Semiconductor Equipment Thermoelectric Cooling
Packaging Detail:Package:Outer package:corrugated export case.Inter package:hard foam case(Various quantity to each type)Outer size:(515*280*330mm)
Delivery Detail:within 7 days you can get your product

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