best quality automatic infrared full automatc BGA rework station ZM-R6200 for laptop/mobile/ps3/xbox360

BGA rework station, laptop repair stations high success, BGA repair station long life, Automtical operationg, EC; ISO9001 - details see: https://www.machineto.com/best-quality-automatic-infrared-full-automatc-bga-rework-station-zm-r6200-for-laptop-mobile-ps3-xbox360-10138142

Type:Other	Place of Origin:Guangdong China (Mainland)	Brand Name:seamark ZM	Model Number:ZM-R6200
Voltage:AC220V 50/60 HZ	Current:N/A	Rated Capacity:4800W	Rated Duty Cycle:N/A
Dimensions:640630900mm	Weight:65kg (Net weight)	Usage:Repair laptop/motheboard/xbox360/PS3	Certification:ISO9001; CE
After-sales Service Provided:Overseas service center available	color::silver	Total power:Max5300W	Material::touch screen, PLC, heating plate
Dimensions::640630900mm	Available BGA chip:Max8080mm ; Min22mm	Power Supply:AC 220V	Electrical selection:Highly sensitive tmperature control module
External temperature:1 pcs	Net weight:68Kg	PCB size:Max410370mm; Min6565mm

BGA rework station

Specifacation

	Total power	4800W Max
2	Top heater power	800W (1^stheater)
3	Bottom heater power	1200W (2^ndheater) smd rework station process
4	3rd IR heater	2700W (independent controlling left and right IR BGA rework station heaters)
5	power	AC 220V±10 50/60Hz
6	Electrical materials	temperature control system Adopted Dalian University of Technology
7	Dimensions	L640W630H900mm
8	Temperature control	K-type thermocouple (Closed Loop), intelligent temperature compensation system
9	Positioning	V type groove,with universal fixture
10	P C B size	Max 410×370mm, Min65×65mm

BGA rework station

Feature:

1.3 independent heating systems

ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. Auto identifies a high degree of suction and mounting. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heater’s capacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time.

BGA rework station

2. Precise optical alignment system

with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within 0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12 inch HD monitor. BGA rework station

High-definition CCD color optical vision system, splitting, amplification, micro-adjust and auto focus, with automatic color resolution and brightness adjustment device.

3. Multi-function operation system

Touch screen interface shows current running temperature curves, what can be analyzed, saved. The temperature can be set to 6 segments and 6 segments constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. With automatic soldering and desoldering functions

4. Precise temperature control system

K-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, Temperature accuracy is within 1 degree. laptop repair stations

Top hot air heater and mounting head is integrated design (2 functions all in). laptop repair stations

5. Superior safety functions laptop repair stations

After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation.

laptop repair stations