automatic wafer machine

automatic wafer machine

lIntroduction:

KHG-27 Flat wafer production line which is one of KeHua company's traditional products used in product

different kind of good wafer, and the capacity about 2.18t/24h. This line had been more reliably and mature

via innovative improvements on the basis of advanced technology within this 20 years.

Baking type: 1. Gas(LNP or LGP),

2. Electricity(380V/3 phase/50Hz).

The standard configuration of this wafer production line: batter mixer, oven, wafer connecting machine, vertical type wafer cooler, wafer collecting machine, cream spreader, wafer conveyor, wafer cutter, cream mixer, wafer smashing machine.

lEquipment & Process:

Production Process: batter mixing----wafer baking----cooling----cream spreading----book cooling----cutting

Equipment: 1.batter mixer 2.oven 3.connecting machine 4.vertical type cooler 5.collecting machine

6.cream spreader 7.wafer conveyor 8.wafer cutter 9.cream mixer 10.wafer smashing machine

lSpecialty & Using:

Products Distinguishing Feature:

(1) The oven has 27 plates and they made of nodular cast iron, the standard dimension of baking plate is 470×325mm. The power transistor and travelling wheel have the Chinese patent, the line have PID temperature

automatic control system and the good affect for wafer sheet.

(2) Batter mixer is made of Stainless Steel. It can mixing 65kg batter with 25kg flour and 40kg water within 5 minutes.

(3) Vertical type wafer cooler is made of Stainless Steel and using the own motor.

(4) The racks of cream spreader are the stainless steel tank, the motor and pneumatic component which both

seal in the tank have good waterproof and dustproof. The spreader has the easy clear design.

(5) Wafer cooling tower is made of Stainless Steel, and the part which touch the wafer book are all made of

Stainless Steel 304. The cooling fan is outlay and the temperature of cooler’s inlet air are 5°C. The relative humidity of cooling tower is 55%.

(6) Wafer cutter is mechanically and the maximum speed of cutting wafer book(filled with cream) are 8 books.

Using: This line is exclusively used in produce different kind of good wafer.

lTechnical advantage:

1) In the field of wafer machines have more than 15 years experiences.

2)According to HACCP design, the controlling and operating for the important equipment will be more

accurately and safely.

3)Have CE, ISO9001:2000, FM.

4)Professional design, material selection more scientifically, processing more accurately.

5)Good quality.

6) Best service and perfect after sale service.

lTechnical Parameter:

1)The standard size of the baking plate is 470×325mm; Pattern(standard) is 2.5×2.5×0.5mm

2)The size of wafer sheet is 464×321mm, The effective cutting size of wafer sheet is 456×315mm.

3)Wafer sheet’s thickness: 2.5mm---3.2mm.

4)Weight of wafer sheet: 50---60g

5)Rated power: 30kw

6)Air compression: 0.9cube/minute

7)Baking time about 2 minutes

8)Worker: 5 people

lSpace: machines using 60 square meter

lPackaging & Container

Packaging: iron and waterproof membrane

Container: one 40’HQ

[Note]: We can make different pattern for the plate according to client’s demands.

Certificate